MONOCRYSTALLINE SILICON - AN OVERVIEW

Wire-saw wafer slicing has become the vital production technologies for industrial crystalline silicon PV cells, and enhancements in wafer slicing technological know-how have resulted in a reduction in Uncooked wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To introduce wafers thinn